E xperimental study on normal force of cutting sapphire with multi-wire swing reciprocating wire saw
Multi-wire swing reciprocating sawing technology is the main machining method used to cut sapphire crys-tal bars into wafer substrates,while normal force is an important index that reflects the processing stability.In this pa-per,the normal force(Fn)during multi-wire swing reciprocating wire saw cutting sapphire crystal bars was measured,and the change in normal force at different positions and cutting depths of the sapphire crystal bars was tracked.The in-fluence of various process parameters on the stability of the machining process was tracked by using the rangeability of normal force(ΔFn)as the index.The experimental results show that Fn is closely correlated with the reciprocating motion of the wire saw and the rocking motion of the workpiece,and ΔFn in the front of the sapphire crystal bar is sig-nificantly different from that in the middle and back.Process parameters such as the wire saw speed(Vs),maximum swing angle(θmax),single piece wire consumption(Md),tensioning force(Fw),and total cutting time(7)have different effects on ΔFn.The fluctuation degree of ΔFn is closely related to the wear of the wire saw.
multi-wire swing reciprocating sawing technologysapphirenormal forcewear and tearmachining sta-bility