金刚石基材料及其表面微通道制备技术在高效散热中的应用
Application of diamond based materials and surface microchannel fabrication technology in efficient heat dissipation
邓世博 1夏永琪 2吴明涛 1岳晓斌 3雷大江1
作者信息
- 1. 四川省精密超精密加工工程技术研究中心,成都 610200
- 2. 南京航空航天大学 机电工程学院,南京 210016
- 3. 中国工程物理研究院 材料研究所,四川 绵阳 621908
- 折叠
摘要
随着第三代半导体材料的兴起,电子器件逐渐向着高功率、小型化、集成化方向发展.传统散热技术已难以满足第三代半导体器件高热流的散热要求,由此带来的温度堆积问题成为器件失效的主要原因.金刚石基材料具有优异的散热性能,基于此材料的高效散热技术有望解决高热流散热难题.总结了金刚石基材料的发展及其表面微通道制备的主要方法,综述了金刚石基材料在高效散热领域中的应用和未来的发展方向.金刚石基材料高效散热技术的发展及应用能够为高热流密度散热难题的解决提供技术支撑.
Abstract
With the rise of third-generation semiconductors,electronic devices are evolving towards high-power,mini-aturization,and integration.Traditional heat dissipation technologies are no longer sufficient to meet the heat dissipa-tion requirements of high heat flux in third-generation semiconductor devices.Temperature accumulation has become a major cause of device failure.Diamond-based materials have excellent thermal properties.Efficient heat dissipation technology based on these materials has become a key direction to solve the high heat flux dissipation problem.This art-icle summarizes the development of diamond-based materials and the main methods for preparing surface microchan-nels.It reviews the application and development trends of diamond-based materials in the field of efficient heat dissipa-tion.The development and application of diamond-based materials for efficient heat dissipation technology can provide technical support for addressing the problem of high heat flux dissipation.
关键词
金刚石/微通道/加工/高效散热Key words
diamond/microchannel/fabrication/efficient heat dissipation引用本文复制引用
基金项目
国家自然科学基金(52005461)
河南省科技重大专项(221100230300)
出版年
2024
国家科技期刊平台
NSTL
万方数据