Application of diamond based materials and surface microchannel fabrication technology in efficient heat dissipation
With the rise of third-generation semiconductors,electronic devices are evolving towards high-power,mini-aturization,and integration.Traditional heat dissipation technologies are no longer sufficient to meet the heat dissipa-tion requirements of high heat flux in third-generation semiconductor devices.Temperature accumulation has become a major cause of device failure.Diamond-based materials have excellent thermal properties.Efficient heat dissipation technology based on these materials has become a key direction to solve the high heat flux dissipation problem.This art-icle summarizes the development of diamond-based materials and the main methods for preparing surface microchan-nels.It reviews the application and development trends of diamond-based materials in the field of efficient heat dissipa-tion.The development and application of diamond-based materials for efficient heat dissipation technology can provide technical support for addressing the problem of high heat flux dissipation.
国家科技期刊平台
NSTL
万方数据
