Research on chemical modification of nickel coating on diamond particles surface
A new nickel plating process for diamond wire is explored to eliminate the negative impact of dispersants on the production process of diamond wires.The surface of of Ni-plated diamond particles was first hydroxylated with hy-drogen peroxide,and then reacted with dimethyloctadecyl[3-trimethoxysilylpropyl]ammonium chloride to prepare pos-itively charged diamond particles.Finally,the preparing process of diamond wires were optimized.Results show that the surface potential of diamond particles increases from-7.50 mV to 14.10 mV or above after reaction,up to 30.68 mV.The best preparing conditions are as follows:The mass ratio of raw sand to hydrogen peroxide is 2 to 1,with treat-ing time of 1 h;The mass ratio of diamond particles to quaternary ammonium salts is 1 to 2,with treating time of 4 h.In the electroplating process,the diamond particles with chemically modified surface would uniformly migrate towards the cathode without dispersants,the sanding capacity of which could be increased by 20%or more.
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