金刚石颗粒表面镍镀层化学改性研究
Research on chemical modification of nickel coating on diamond particles surface
邹余耀 1田晓庆 1高传平 1韩国志2
作者信息
- 1. 江苏三超金刚石工具有限公司,江苏 句容 212400
- 2. 江苏三超金刚石工具有限公司,江苏 句容 212400;南京工业大学 化学与分子工程学院,南京 211816
- 折叠
摘要
为消除金刚线生产过程中分散剂对工艺的负面影响,探索新的金刚线镀镍工艺.首先,使用H2O2 对镀镍金刚石颗粒表面进行羟基化;然后,将其同二甲基十八烷基[3-(三甲氧基硅)丙基]氯化铵进行反应,制备表面带正电的金刚石颗粒;最后,对金刚线的制备工艺进行优化.研究结果表明:反应后金刚石颗粒的表面电位从-7.50 mV转变至 14.10 mV以上,最高可达 30.68 mV.其最佳制备条件为原砂与H2O2 的质量比为2∶1,处理时间为 1 h;金刚石颗粒与季铵盐的质量比为 1∶2,处理时间为 4 h.在电镀过程中,经表面化学修饰的金刚石颗粒能够在没有分散剂的条件下,均匀地向阴极迁移,其上砂量增多20%以上.
Abstract
A new nickel plating process for diamond wire is explored to eliminate the negative impact of dispersants on the production process of diamond wires.The surface of of Ni-plated diamond particles was first hydroxylated with hy-drogen peroxide,and then reacted with dimethyloctadecyl[3-trimethoxysilylpropyl]ammonium chloride to prepare pos-itively charged diamond particles.Finally,the preparing process of diamond wires were optimized.Results show that the surface potential of diamond particles increases from-7.50 mV to 14.10 mV or above after reaction,up to 30.68 mV.The best preparing conditions are as follows:The mass ratio of raw sand to hydrogen peroxide is 2 to 1,with treat-ing time of 1 h;The mass ratio of diamond particles to quaternary ammonium salts is 1 to 2,with treating time of 4 h.In the electroplating process,the diamond particles with chemically modified surface would uniformly migrate towards the cathode without dispersants,the sanding capacity of which could be increased by 20%or more.
关键词
金刚线/镍镀层/化学修饰/电镀Key words
diamond wire/nickel coating/chemical modification/electroplating引用本文复制引用
出版年
2024
国家科技期刊平台
NSTL
万方数据