基于单颗金刚石划擦的单向Cf/SiC复合材料去除机理
Removal mechanism of unidirectional Cf/SiC composites based on single diamond grit scratching
温家宙 1王庆霞 2余爱武 3吴重军2
作者信息
- 1. 东华大学 机械工程学院,上海 201600
- 2. 东华大学 机械工程学院,上海 201600;上海航天工艺与装备工程技术研究中心,上海 201108
- 3. 上海航天设备制造总厂有限公司,上海 201108;上海航天工艺与装备工程技术研究中心,上海 201108
- 折叠
摘要
为研究单向Cf/SiC复合材料划擦去除机理,采用单颗金刚石磨粒开展准静态划擦试验,分析不同压痕载荷下划擦材料的声发射信号变化,结合SEM形貌分析材料的去除行为和划擦去除机理.试验结果表明:声发射信号强度随着压痕载荷增加而增强,相同参数下SB方向信号值更大,信号波动更剧烈.结合声发射信号与SEM形貌分析,得出材料在不同方向的划擦去除行为,材料以脆性去除为主,SA方向纤维以拉伸断裂和纤维拔出为主,SB方向纤维主要断裂方式为弯曲断裂和剪切断裂.根据SEM形貌分析,阐述去除行为的形成过程,即解释材料划擦去除机理.
Abstract
To investigate the scratch removal mechanism of unidirectional Cf/SiC composite materials,quasi-static scratching tests were carried out using a single diamond abrasive grain to analyze the changes in acoustic emission sig-nals of the scratched materials under different indentation loads.These tests were complemented by SEM images to ana-lyze the removal behavior and scratch removal mechanism of the materials.The test results show that the acoustic emis-sion signal value increases with the increase in indentation load.Under the same parameters,the signal value in the SB direction is larger,and the signal fluctuation is more severe.Combining the acoustic emission signal and SEM morpho-logy analysis,it is concluded that the scratch removal behavior of the material varies in different directions.The materi-al primarily undergoes brittle removal.In the SA direction,fibers mainly experience tensile fracture and fiber pull-out,whereas in the SB direction,the main fracture modes of the fiber are bending fracture and shear fracture.According to the SEM morphology analysis,the formation process of the removal behavior and the material scratch removal mechan-ism are described.
关键词
单向Cf/SiC复合材料/单颗磨粒划擦试验/声发射信号/材料去除机理Key words
unidirectional Cf/SiC composites/single diamond grit scratching/acoustic emission signal/material re-moval mechanism引用本文复制引用
基金项目
国家自然科学基金(52005098)
上海市自然科学基金(22ZR1402400)
上海航天科技创新基金(SAST2022-059)
中国博士后科学基金(2022M721910)
出版年
2024
国家科技期刊平台
NSTL
万方数据