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板级光电互联技术发展现状与趋势

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光电互联技术在光电通信、光电导航等军事领域,高性能处理器以及民用通信等领域有着独特的优势。对于目前高性能计算和高速率通信系统中,无论是板到板还是板内各模块之间的链路,对更高带宽的需求持续增加,光电互联可代替传统电互联解决这一问题,同时降低系统成本与功耗,使系统微型化、高性能化。光电互联技术按光传输介质可分为自由空间光互联技术、聚合物光波导光电互联技术、光纤光电互联技术三类。简要介绍了光电互联技术的定义与三类光电互联技术,阐述了国内外聚合物光波导光电互联技术与光纤光电互联技术的发展动态,讨论对比了三类光电互联技术优缺点,指出了该领域的关键技术与发展趋势,为我国在该领域未来的研究方向提供参考。
Development Status and Trend of Board-Level Photoelectric Interconnection Technology
Photoelectric interconnection technology has distinct advantages in military fields,such as photoelectric communication and navigation,high-performance processors,and civil communication.The demand for higher bandwidth continues to increase for the current high-performance computing and high-rate communication systems,whether it is board-to-board or the link between modules on the board.Photoelectric interconnection can be used to alleviate this issue,and reduce the system costs and power consumption,allowing the system to be downsized and high-performing.Optical interconnection technology is classified into three types based on the optical transmission medium:free-space optical interconnection technology,polymer optical waveguide optical interconnection technology,and optical fiber optical interconnection technology.The definition and three types of photoelectric interconnection are introduced briefly,and the development trends of polymer optical guide photoelectric interconnection and optical fiber photoelectric interconnection at home and abroad are expounded.After weighing the benefits and drawbacks of the three types of photoelectric interconnection,the key technology and development trends in this field are identified.It serves as a reference for future research directions in this field.

optoelectronicsphotoelectric interconnectionpolymer optical waveguide photoelectric interconnectionoptical fiber photoelectric interconnectionphotoelectric printed circuit boar

杜耀辉、侯霞

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中国科学院上海光学精密机械研究所航天激光工程部,上海 201800

光电子 光电互联 聚合物光波导光电互联 光纤光电互联 光电印刷电路板

国家自然科学基金

22X0152601

2024

激光与光电子学进展
中国科学院上海光学精密机械研究所

激光与光电子学进展

CSTPCD北大核心
影响因子:1.153
ISSN:1006-4125
年,卷(期):2024.61(7)
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