摘要
InGaAs单光子探测器已被广泛应用于激光三维成像、长距离高速数字通信、自由空间光通信和量子通信等.针对单元、线列和小面阵器件,已发展出同轴封装、蝶形封装、插针网格阵列封装等多种封装形式.探讨了温度对InGaAs单光子器件性能的影响及组件温控方法;系统比较分析了针对光学元件如微透镜、透镜、光纤等与芯片的高精度耦合方法;针对高频信号输出,总结了引线类型、布线方式、封装结构设计等问题;展望了InGaAs单光子探测器的发展趋势.
Abstract
InGaAs single-photon detectors are extensively used in laser 3D imaging,long-distance high-speed digital communication,free-space optical communication,and quantum communication.Different packaging formats,including coaxial packaging,butterfly packaging,and pin grid array packaging,have been designed for unit,line array,and small panel array devices.The impact of the temperature on the efficacy of InGaAs single-photon devices and the methodologies for controlling component temperature are discussed.Detailed comparisons and analyses of high-precision coupling methods for optical components such as microlenses,lenses,optical fibers,etc.to the semiconductor are provided.For high-frequency signal output,the lead type,wiring method,packaging structure design,and other issues are reviewed,and the development trend of the InGaAs single-photon detectors is forecasted.
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