首页|基于电荷分配和LOFIC技术的高动态范围像素的设计与仿真

基于电荷分配和LOFIC技术的高动态范围像素的设计与仿真

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针对像素动态范围不足的问题,提出一种采用电荷分配和横向溢流集成电容(LOFIC)技术的高动态范围像素结构。通过分裂LOFIC电容并增加光生电荷的直接溢流通路,将曝光期间收集的溢出电荷在分裂后的两个电容间按电容值进行分配,并对较大电容进行动态刷新,实现高光信号电压的压缩,提升像素的满阱容量(FWC),扩展其动态范围,调节电荷分配和动态刷新次数以及分裂后的电容比例可实现不同程度的动态范围扩展。基于110 nm互补金属氧化物半导体工艺设计了尺寸为6 μm×6 μm的像素,高转换增益(HCG)为128 μV/e-,总体LOFIC电容为31。36 fF。仿真结果表明,当电容提升因子为7时,电荷分配LOFIC像素的FWC为1。43 Me-,动态范围可达116。8 dB,与传统LOFIC像素结构相比,电荷分配LOFIC像素的动态范围扩展了16。6 dB。表明电荷分配LOFIC像素能够在有限的电容条件下实现更高的动态范围。
Design and Simulation of High Dynamic Range Pixel with Charge Distribution and LOFIC Technology
To solve the problem of insufficient pixel dynamic range,a high dynamic range pixel structure using charge distribution and lateral overflow integrated capacitor(LOFIC)technology is proposed.By splitting LOFIC capacitances and increasing the direct overflow path for a photogenerated charge,the collected overflow charge is distributed between two split capacitors according to the capacitance value during exposure period,and the larger capacitance is dynamically refreshed to realize the compression of high light signal voltage,which enhances the pixel's full-well capacity(FWC)and dynamic range.The adjustment of the number of charge distribution and dynamic refresh and the ratio of capacitance splitting can realize different extensions of dynamic range.In this study,a 6 μm×6 μm pixel is designed based on a 110 nm complementary metal oxide semiconductor process with a high conversion gain(HCG)of 128 μV/e-and an overall LOFIC capacitance of 31.36 fF.Simulation results show that the pixel has a FWC of 1.43 Me-when the capacitance boosting factor is 7,and dynamic range can be up to 116.8 dB.Compared with traditional LOFIC pixel,proposed dynamic range is extended by 16.6 dB.The results indicate that charge distribution LOFIC pixel can achieve higher dynamic range under limited capacitance conditions.

complementary metal oxide semiconductor image sensorlateral overflow integrated capacitordynamic rangecharge distributionpixel

张玉增、高志远、徐江涛

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天津大学微电子学院,天津 300072

天津市成像与感知微电子技术重点实验室,天津 300072

互补金属氧化物半导体图像传感器 横向溢流集成电容 动态范围 电荷分配 像素

2024

激光与光电子学进展
中国科学院上海光学精密机械研究所

激光与光电子学进展

CSTPCD北大核心
影响因子:1.153
ISSN:1006-4125
年,卷(期):2024.61(21)