红外探测器锗窗口无助焊剂回流焊接工艺研究
Study on reflow soldering process without flux for Ge window of infrared detectors
赵璨 1回品 1李硕1
作者信息
- 1. 华北光电技术研究所,北京 100015
- 折叠
摘要
对红外探测器锗窗口无助焊剂回流焊接工艺进行了研究,在还原性气氛下使用铟焊料片对不同镀层体系的锗窗口和可伐合金进行了焊接试验.通过对不同镀层体系下焊接的窗口部件的焊缝形貌、真空漏率分析、X射线无损检测分析以及可靠性试验分析,表明通过对锗窗口和可伐合金焊接面镀金处理,在还原性气氛下回流焊接可以制备出满足密封要求和环境适应性要求的窗口部件.
Abstract
In this paper,the reflow soldering process without flux for Ge window of infrared detectors is investigated,and soldering tests on Ge windows and Kovar alloys with different plating systems are conducted using In solder pieces in a reducing atmosphere.Through the analysis of weldappearance,vacuum leak rate,X-ray NDT,and reliability test of window components soldered under different plating systems,it is shown that gold plating on the soldering surface of Ge windows and Kovar alloys can be used to prepare window components that meet the requirements of sealing and en-vironmental adaptability under reflow soldering in a reducing atmosphere.
关键词
红外探测器/锗窗口/回流焊接/还原性气氛Key words
infrared detector/Ge window/reflow soldering/reducing atmosphere引用本文复制引用
出版年
2024
NETL
NSTL
万方数据