芯粒集成技术研究进展
Research Progress of Core-Particle Integration Technology
马鹏1
作者信息
- 1. 三微电子科技(苏州)有限公司,江苏 苏州 215028
- 折叠
摘要
芯粒集成技术作为一种可以延续摩尔定律的解决方案受到了学术界和产业界的高度关注,但其广泛应用还存在诸多问题.详细地总结了近十年来芯粒集成技术的研究进展和其独特优势,阐述了应用于芯粒集成技术的接口、标准和先进封装类型,研究了与芯粒集成相关的机遇和挑战,并对未来芯粒集成技术的发展进行了预测.
Abstract
As a solution that can continue Moore's Law,core-particle integration technology has been highly concerned by academia and industry,but there still exist many problems in its wide application.In this paper,the research progress and unique advantages of core-particle integration technology in recent ten years are summarized in detail,the interface,standard and advanced package types applied to core-particle integration technology are described,the opportunities and challenges related to core-particle integration technology are studied,and the future development of core-particle integration technology is predicted.
关键词
芯粒/异构集成/芯片封装/芯片集成Key words
core-particle/heterogeneous integration/chip packaging/chip integration引用本文复制引用
出版年
2024
NETL
NSTL
万方数据