摘要
密封固态继电器采用半导体功率器件作为开关元件,无动作部件、无机械触点、无电火花产生,具有优异的抗冲击、振动性能,被广泛应用于航天、航空、装甲车等领域.在固态继电器生产和装配过程中,可能将松香、焊锡渣、金属碎屑、密封飞溅物、硅基碎屑、键合尾丝、陶瓷基板碎屑、印制板碎屑、人体皮屑、衣服纤维等多余物微粒密封在腔体内部,威胁分系统应用安全.文章基于多余物的检测,分析多余物的类型及产生原因,提出多余物控制方法.
Abstract
The hermetic solid-state relay uses semiconductor power devices as switching elements,without moving parts,mechanical contacts and electric sparks.It has excellent impact resistance and vibration perform-ance.It is widely used in aerospace,aviation,armored vehicles and other fields.During the production and assem-bly of solid-state relay,it is possible to seal the residual particles such as rosin,solder slag,metal debris,sealing splash,silicon-based debris,bonding tail wire,ceramic substrate debris,printed board debris,human skin deb-ris,clothing fiber,etc.in the cavity Inside,threatening the application security of the subsystem.Based on the detection of superfluous substances,this paper analyzes the types and causes of superfluous substances,and puts forward the control method of superfluous substances.
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