Analysis of attachment fluid in process exhaust system of electronic semiconductor factory
In order to ensure the normal operation of the process machine and not be affected by the various problems of the process exhaust adhesion fluid,the analysis was carried out.The adhesive solution problems mainly include chemical adhesive solution corrosion,acid and alkali treatment equipment drug solution corrosion,air pipe wall condensate and so on.The causes and solutions of the above problems have guiding significance for the future exhaust construction of semiconductor engineering process.
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维普
