Research on Interconnection Technology of High-precision Integrated Inductive Circuits
The article through the establishment of blind hole filling copper model,rigid circuit board high thickness to diameter ratio and flexible circuit board through-hole plating copper model.At the same time,based on electrochemical test results of copper plating numerical simulation calculations,the plating solution convection on the concentration of the boundary layer of the influence of the accelerator on the surface of the accumulation effect of the electrode,the uniformity of the plating layer,plating bath in the electric field distribution,the role of the additives mechanism and so on were analyzed.Through the design of printed circuit graphics,graphic electroplating plating uniformity of factors affecting the analysis,in order to determine the optimal process and parameters.Achieving the plating of copper surface homogeneity of the thickness of the same layer with the effect of filling the flatness of copper,so as to achieve the purpose of reducing the diameter of the blind hole aperture diameter,reduce the depth of holes,the copper layer,the surface of the thickness of the copper layer and the thickness of corrosion-resistant film.Through the study,the article realized the microfabrication of high-density interconnection printed circuit board lines,and achieved the effect of smaller electrical interconnection holes,higher density,reliability and induction degree.
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