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集成电路板制备装置及关键技术研究

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伴随着电子技术和半导体技术的高速发展,为了满足社会生产活动中对集成电路板性能越来越高的需求,文章对集成电路板的制备装置及关键技术进行了研究,主要研究内容为高频、高速、高散热及高导热等关键技术,同时提出了相应的制造技术方案并应用于实际生产活动中,为集成电路板技术的研究和应用提供了一定参考.
Research on Integrated Circuit Board Preparation Equipment and Key Technologies
With the rapid development of electronic technology and semiconductor technology,in order to meet the increasing demand for integrated circuit board performance in social production activities.This article studies the preparation equipment and key technologies of integrated circuit boards.The main research content is key technologies such as high frequency,high speed,high heat dissipation and high thermal conductivity.The corresponding manufacturing technology solutions are proposed and applied in actual production activities,provides a certain reference for the research and application of integrated circuit board technology.

integrated circuitspreparation equipmentkey technologies

王建全、李保霞、卢晓燕、刘徐、付晓丽

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四川经科企业管理服务有限公司,四川遂宁 629000

四川海英电子科技有限公司,四川遂宁 629000

集成电路 制备装置 关键技术

2024

今日自动化

今日自动化

ISSN:
年,卷(期):2024.(10)