Research on PCB Welding Process Based on Aluminum Substrate
With the rapid development of electronic technology,the performance requirements for electronic devices are becoming increasingly high.Aluminum substrates have been widely used in high-performance electronic devices due to their excellent thermal conductivity,light weight,and relatively low cost.However,there are some technical difficulties in the PCB soldering process of aluminum substrates,such as unstable soldering performance and difficult control of solder joint quality.In view of this,the PCB welding process based on aluminum substrate was studied,and the welding process parameters were experimentally demonstrated,providing theoretical basis and practical guidance for improving the welding quality of aluminum substrate PCB.
aluminum substratePCB solderingwelding process parameterswelding quality
万方数据
维普
