基于故障树分析法的舰载武器装备电子元器件及PCB的失效研究
Failure Study of Electronic Components and PCB of Shipborne Weapon Equipment Based on Fault Tree Analysis
吴尽哲 1马知远 1郭月婷 1雷増垚 1吴文全1
作者信息
- 1. 海军工程大学 电子工程学院,武汉 430030
- 折叠
摘要
目的 对极端海洋环境下某型舰声呐装置中的多功能信号发生器进行失效研究.方法 使用故障树分析法作为失效分析基本方法.首先通过微焦点CT检测技术对样品进行准确的失效定位,并通过扫描电子显微镜和能谱分析样品的失效机理.然后结合应用背景,分析归纳样品失效的机理因子和影响因素.最后,针对每种失效形式提出具体的改善方案.结果 由电阻本身表面形貌、额定温度及外部环境(高温、高湿、高盐)等原因,导致含有盐雾的水汽进入电阻内部,致使电阻内部出现电化学迁移现象,电阻阻值因此明显降低,最终导致多功能信号发生器出现失效.结论 舰艇中的电子设备,如多功能信号发生器的失效往往是由设计制造及各种海洋环境因素综合作用所造成的.这就要求舰载电子设备的研制方、使用方都应重视海洋环境适应性问题,并采取一定的改善措施.
Abstract
The work aims to study the failure of the multifunctional signal generator in the sonar system of a ship in an ex-treme ocean environment.Fault tree analysis was used as the basic method of failure analysis.Firstly,the micro-focus CT detec-tion technology was used to accurately locate the failure of the sample.The failure mechanism of the sample was analyzed by scanning electron microscopy and energy spectrum analysis,and the mechanism factors and influencing factors of sample fail-ure were summarized in combination with the application background.Finally,specific improvement schemes were proposed for each failure form.Due to the surface topography of the resistance itself,the rated temperature and the external environment(high temperature,high humidity,high salt),the water vapor containing salt spray entered the resistance,resulting in electro-chemical migration inside the resistance,the resistance value was significantly reduced,and finally lead to the failure of the multi-function signal generator.The failure of electronic equipment,such as multi-function signal generators,is often caused by the combination of design and manufacturing and various marine environmental factors.This requires that the developers and users of shipborne electronic equipment should pay attention to the adaptability of the marine environment and take certain im-provement measures.
关键词
舰载武器装备/故障树分析法/失效分析/环境适应性/电子元器件/印刷电路板Key words
shipborne weapon equipment/fault tree analysis/failure analysis/environmental adaptability/electronic com-ponents/printed circuit board引用本文复制引用
出版年
2024
NETL
NSTL
维普
万方数据