Considering the embedded engineering application of multi-channel DDR4 for high-performance many-core processor,a high-density DDR4 fly-by interconnect structure was designed,and the analysis method based on different excitation codes was proposed.To realize the optimized folded fly-by structure which could effectively eliminate the potential error fined in simulation,a double-sided blind technology was adopted in printed circuit board process.Interconnect system with such structure,nominal 2666 Mbps DDR4 DRAMS can operate stably at 3000 Mbps data rate,and measured signal waveforms perform well.The struc-ture has been applied on several large computing systems such as Sunway Exascale prototype,and has produced good technical benefits.
关键词
双倍数据速率/同步动态随机存取存储器/折叠串推/码型仿真/信号传输/盲孔/超频
Key words
double data rate(DDR)/synchronous dynamic random access memory(SDRAM)/folded fly-by/code based simula-tion/signal transmission/bland-via/over-frequency
维普
万方数据