Adaptive variable step size scanning and matching algorithm based on local chip distribution feature identification
To solve problems of missing scanning and matching error in LED die testing and sorting,an adaptive variable step size scanning method was proposed to analyze regional die distribution characteristics by using the continuity and reten-tion of the local deformation of adhesive membrane,and to make available step size adjustment.At the prober,a character-ization and description method based on 8-neighborhood location model was proposed,and an adaptive variable step size ad-justment strategy was established.At the sorter,a traversal matching method was put forward to make plan for reasonable scanning area and path with normalized map and physical address map produced in prober.The experimental results showed that such algorithm could limit the scanning redundancy ratio to less than 4％,obtain the missed scanning ratio less than 0.5％and improve the scanning performance by about 23％than that of traditional redundancy-based scanning method.Because only searching for qualified dies,the matching rate of nearly 100％could be achieved,and the efficiency and anti-interference ability of the algorithm could be significantly improved.
wafer bin maplogic view normalizationactive traversalposition relationshipindex match
万方数据
维普
