材料热处理学报2024,Vol.45Issue(1) :87-94.DOI:10.13289/j.issn.1009-6264.2023-0229

均匀化退火对Cu-Ni-P合金组织和性能的影响

Effect of homogenization annealing on microstructure and properties of Cu-Ni-P alloy

皇保欢 张彦敏 李吉宝 杨耀鹏 高红姣 冯江 张朝民 宋克兴
材料热处理学报2024,Vol.45Issue(1) :87-94.DOI:10.13289/j.issn.1009-6264.2023-0229

均匀化退火对Cu-Ni-P合金组织和性能的影响

Effect of homogenization annealing on microstructure and properties of Cu-Ni-P alloy

皇保欢 1张彦敏 2李吉宝 3杨耀鹏 1高红姣 1冯江 2张朝民 2宋克兴4
扫码查看

作者信息

  • 1. 河南科技大学材料科学与工程学院,河南洛阳 471023
  • 2. 河南科技大学材料科学与工程学院,河南洛阳 471023;有色金属新材料与先进加工技术省部共建协同创新中心,河南洛阳 471023;河南省有色金属材料科学与加工技术重点实验室,河南洛阳 471023
  • 3. 宁波博威合金材料股份有限公司,浙江宁波 315000
  • 4. 河南科技大学材料科学与工程学院,河南洛阳 471023;河南省科学院,河南郑州 450046
  • 折叠

摘要

对铸态Cu-Ni-P合金进行了不同温度(850、900和950 ℃)保温不同时间(1、2和3 h)的均匀化退火处理,以确定合理的退火温度;在确定的合理温度下进行了不同时间的均匀化退火处理,以确定最佳的保温时间,进而得到合金最优的均匀化退火工艺.对比分析铸态和均匀化退火后Cu-Ni-P合金的组织和性能.结果表明:铸态Cu-Ni-P合金偏析严重,树枝晶杂乱分布,一次枝晶臂长明显大于二次枝晶臂,在枝晶间隙中存在着大量的第二相颗粒;铸态下合金导电率为49.5%IACS,硬度为85.6 HV,抗拉强度为204 MPa.均匀化退火能够显著消除Cu-Ni-P合金中的枝晶偏析,温度对枝晶偏析的改善效果大于保温时间,合金的最佳均匀化退火工艺为900 ℃×4 h;经最佳工艺处理后合金的导电率为38.9%IACS,硬度为113.8 HV,抗拉强度为290 MPa,与铸态相比,导电率有所下降,但抗拉强度和硬度分别提高了 42.2%和32.9%.拉伸断口分析表明均匀化退火处理前后合金均属于韧性断裂.

Abstract

The homogenizing annealing treatment of as-cast Cu-Ni-P alloy was carried out at different temperatures(850,900 and 950 ℃)for different time(1,2 and 3 h)to determine a optimal annealing temperature.Different time homogenization annealing treatments were carried out at the optimal temperature to determine the optimal holding time and obtain the optimal homogenization annealing process for the alloy.Microstructure and properties of the Cu-Ni-P alloy in as cast state and after homogenization annealing were compared and analyzed.The results show that the as cast Cu-Ni-P alloy exhibits severe segregation,dendrites are haphazardly distributed,the length of the primary dendrite arm is significantly longer than that of the secondary dendrite arm,and there are a large number of second phase particles in the dendrite gap.The conductivity of the as cast alloy is 49.5%IACS,the hardness is 85.6 HV,and the tensile strength is 204 MPa.Homogenization annealing can significantly eliminate dendrite segregation in the Cu-Ni-P alloy,and the improvement effect of temperature on dendrite segregation is greater than that of holding time.The optimal homogenization annealing process for the alloy is 900 ℃×4h.The conductivity,hardness and tensile strength of the alloy treated by the optimal process are 38.9%IACS,113.8 HV and 290 MPa,respectively.Compared with the as cast alloy,the conductivity decreases,but the tensile strength and hardness increase by 42.2%and 32.9%,respectively.The tensile fracture analysis shows that the alloy belongs to ductile fracture before and after homogenization annealing treatment.

关键词

Cu-Ni-P/均匀化退火/组织/性能

Key words

Cu-Ni-P/homogenization annealing/microstructure/property

引用本文复制引用

基金项目

国家自然科学基金(52173297)

宁波市创新联合体专项(2021H003)

河南省重大科技专项(221100210300)

出版年

2024
材料热处理学报
中国机械工程学会

材料热处理学报

CSTPCD北大核心
影响因子:0.958
ISSN:1009-6264
参考文献量21
段落导航相关论文