首页|SiCp/Al-Si基复合材料界面结构调控及强化机制的研究进展

SiCp/Al-Si基复合材料界面结构调控及强化机制的研究进展

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SiCp/Al-Si基复合材料具有高的比强度、比刚度、比模量,良好的导热、导电、耐磨性及尺寸稳定性等优点,作为结构功能性材料应用于空间工程、电子封装、交通运输和精密仪器等领域.其研究热点主要集中在界面结构调控、强化机制及性能调控等方面.在SiCp/Al-Si复合材料中存在着增强体与基体界面、析出相与基体界面、析出相与增强体界面,这些界面受各种因素影响,会出现多种界面反应和界面产物,界面结构和结合状态复杂而多样.基于此,本文综述了制备工艺、基体合金成分和SiCp表面改性等方面对SiCp/Al-Si基复合材料界面结构的影响及调控,并总结了影响其力学性能的因素及强化机制的研究现状,最后对复合材料未来的发展及研究方向进行了展望.
Research progress on interface structure control and strengthening mechanism of SiCp/Al-Si matrix composites
SiCp/Al-Si composites have advantages such as high specific strength,specific stiffness,specific modulus,good thermal conductivity,electrical conductivity,wear resistance,and dimensional stability,and thereby they are used as structural and functional materials in the fields such as space engineering,electronic packaging,transportation and precision instruments.The hot research topic about it mainly focus on interface structure control,strengthening mechanisms and performance control.In the SiCp/Al-Si composites,there are interfaces between reinforcement and matrix,precipitation phase and matrix,and precipitation phase and reinforcement phase.These interfaces are influenced by various factors,resulting in various interface reactions and products,and the interface structure and binding state are complex and diverse.Based on this,this article reviews the influence and control of preparation process,matrix alloy composition and SiCp surface modification on the interface structure of the SiCp/Al-Si composites,and summarizes the factors that affect their mechanical properties and the research status of strengthening mechanisms.Finally,it prospects the future development and research directions of the composites.

SiCp/Al-Si compositesinterface structure controlmechanical propertystrengthening mechanismmulti-scale research

苏嶓、王爱琴、谢敬佩、刘瑛、张津浩、柳培、梁婷婷

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河南科技大学材料科学与工程学院,河南 洛阳 471023

有色金属新材料与先进加工技术省部共建协同创新中心,河南 洛阳 471023

SiCp/Al-Si复合材料 界面结构调控 力学性能 强化机制 多尺度研究

国家自然科学基金面上项目

52171138

2024

材料热处理学报
中国机械工程学会

材料热处理学报

CSTPCD北大核心
影响因子:0.958
ISSN:1009-6264
年,卷(期):2024.45(2)
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