首页|高导热多孔石墨预制体的制备及其性能

高导热多孔石墨预制体的制备及其性能

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以天然鳞片石墨、酚醛树脂以及中间相碳微球为主要原料,制备多孔石墨预制体,经石墨化处理后再与环氧树脂复合,获得高导热石墨/环氧树脂复合材料.研究了素坯成形密度和粉末组成对多孔石墨预制体X-Y方向的导热性能与孔隙率的影响.结果表明:预制体内部石墨片定向排列,酚醛树脂与中间相碳微球连接其间,形成定向多孔网络结构,实现高导热、高孔隙与大孔径的协同.当素坯成形密度为1.4 g/cm3,天然鳞片石墨、酚醛树脂、中间相碳微球的含量分别为67.5 mass%、17.5 mass%和15 mass%时,多孔石墨预制体X-Y方向导热性能达到286.97 W/(m·K),气孔率达到44.56%;此时,石墨/环氧树脂复合材料X-Y方向导热性能达到 116.81 W/(m·K)、抗压强度为 26 MPa,在电子封装领域具有潜在的应用前景.
Preparation of high thermal conductivity porous graphite preforms and its performance
A porous graphite preform was prepared using natural flake graphite,phenolic resin,and mesocarbon microspheres as the main raw materials.After graphitization treatment,it was composite with epoxy resin to obtain high thermal conductivity graphite/epoxy resin composites.The effects of green bodies forming density and powder composition on the thermal conductivity in the X-Y direction and porosity of the porous graphite preforms were studied.The results show that the graphite flakes in the preforms are arranged in a directional manner,and the phenolic resin and mesocarbon microbeads are connected between them to form a directional porous network structure,which realizes the synergy of high thermal conductivity,high porosity and large pore size.When the forming density of the green body is 1.4 g/cm3,and the contents of natural flake graphite,phenolic resin,and mesocarbon microspheres are 67.5 mass%,17.5 mass%and 15 mass%,respectively,the thermal conductivity in the X-Y direction of the porous graphite preform reaches 286.97 W/(m·K),and the porosity reaches 44.56%.At this time,the thermal conductivity of the graphite/epoxy resin composites in the X-Y direction reaches 116.81 W/(m·K),and the compressive strength is 26 MPa,which has potential application prospects in the field of electronic packaging.

high thermal conductivitydirectional arrangement structurenatural flake graphitepreparation of porous materials

吴海华、魏恒、吴正佳、郝佳欢、戢运鑫、曾世渝、李思维

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三峡大学机械与动力学院,湖北 宜昌 443000

三峡大学石墨增材制造技术与装备湖北省工程研究中心,湖北 宜昌 443000

高导热 定向排列结构 天然鳞片石墨 多孔材料制备

国家自然科学基金

51575313

2024

材料热处理学报
中国机械工程学会

材料热处理学报

CSTPCD北大核心
影响因子:0.958
ISSN:1009-6264
年,卷(期):2024.45(2)
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