首页|烧结温度对车用石墨-TiB2增强铜基复合材料组织与性能的影响

烧结温度对车用石墨-TiB2增强铜基复合材料组织与性能的影响

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采用真空热压烧结方法制备了石墨和TiB2混杂增强Cu基复合材料,研究了烧结温度对复合材料微观结构、致密度、显微硬度、电导率和摩擦磨损性能的影响.结果表明:烧结过程中各粉末原料没有发生氧化,同时粉末之间也没有发生化学反应.两种增强相均匀地分散在连续的Cu基体中,同时颗粒之间没有形成聚集.随着烧结温度的升高,复合材料的致密度和显微硬度先增大后减小,摩擦系数和磨损率先减小后增大,电导率逐渐降低.烧结温度为800℃时,石墨和TiB2混杂增强Cu基复合材料具有较优异的综合性能,其致密度、显微硬度、电导率、摩擦系数和磨损率分别为98.8%、92.2HV0.1、43.2%IACS、0.213和1.757×10-5mm3/(N·m),磨损机制为显微切削为主,粘着磨损为辅.
Effect of sintering temperature on microstructure and properties of automative graphite-TiB2 reinforced copper matrix composites
Graphite and TiB2 hybrid reinforced Cu matrix composites were prepared using vacuum hot pressing sintering method.The effect of sintering temperature on microstructure,density,microhardness,conductivity and friction and wear properties of the composites was studied.The results show that during the sintering process,there is no oxidation of each powder raw material,and no chemical reaction occurs between the powders.The two reinforcing phases are uniformly dispersed in the continuous Cu matrix,and no aggregation is formed between the particles.As the sintering temperature increases,the density and microhardness of the composites first increase and then decrease,while the friction coefficient and wear rate first decrease and then increase,and the conductivity gradually decreases.When the sintering temperature is 800℃,the graphite and TiB2 hybrid reinforced Cu matrix composites exhibit excellent comprehensive properties,with density,microhardness,conductivity,friction coefficient and wear rate of 98.8%,92.2 HV0.1,43.2%IACS,0.213 and 1.757×10-5 mm3/(N·m),respectively,and the wear mechanism is mainly micro cutting,supplemented by a small amount of adhesive wear.

Cu matrix compositessintering temperaturemechanical propertycoefficient of frictionwear rate

高希瑞、李恒青、韦江、郑宝超、刘洋赈

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上海交通职业技术学院汽车工程学院,上海 201900

暨南大学先进耐磨蚀及功能材料研究院,广东 广州 510632

江西省科学院应用物理研究所,江西 南昌 330096

Cu基复合材料 烧结温度 力学性能 摩擦系数 磨损率

广东省基础与应用基础研究基金浙江省教育厅科技项目江西省科学院博士项目江西省科学院博士项目

2020A1515111067FG20191452018-XTPH1-112018-YYB-11

2024

材料热处理学报
中国机械工程学会

材料热处理学报

CSTPCD北大核心
影响因子:0.958
ISSN:1009-6264
年,卷(期):2024.45(5)
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