Effect of Cold-Rolling Deformation on Microstructure,Properties,and Precipitation Behavior of High-Performance Cu-Ni-Si Alloys
The advancement of integrated circuit manufacturing process and chip packaging technology has improved the performance requirements for lead frame copper alloy.In the field of high-performance copper alloys,balancing and improving mechanical and electrical conductivity(EC)has been a challenge.This work investigates the effect of different cold-rolling deformations(0,65%,75%,85%,and 95%)on the microstructure,properties,and precipitation behavior of Cu-3.0Ni-0.60Si-0.16Zn-0.15Cr-0.03P alloy to en-hance its comprehensive performance through process control.The deformation-aging process parame-ters of high-performance Cu-Ni-Si alloys were determined by comparing the precipitation and recrystalli-zation initial temperatures,microstructures,and properties of the samples after aging.The effect of cold-rolling deformation on precipitation kinetics and mechanism was studied.By optimizing the process parame-ters,the properties of the alloy are observed to be better than the existing Cu-Ni-Si alloys after 95%cold-rolling deformation and aging at 450℃ for 60 min,with an ultimate tensile strength of(841±10)MPa,and an EC of(52.2±0.3)%IACS.This work's relevant research findings can provide theoretical reference and data support for realizing the comprehensive property enhancement of high-performance copper alloys.
万方数据
维普
