Recent Progress on Thermo-Mechanical Reliability of Sn-Based Alloys and Composite Solder for Microelectronic Interconnection
Over the past few decades,electronic products have evolved towards miniaturization,in-telligence,and multi-functionality.With the rapid development of new energy vehicles and 5G mobile com-munication technologies,solder,the most commonly used interconnecting material in the microelectronic industry,may continuously undergo alternating temperature excursions.As a result,researchers have fo-cused on improving the thermomechanical reliability of solder joints.For several decades,researchers have widely studied Sn-based lead-free solder and have established that adding an alloying element or foreign reinforcement can overcome the limitations of traditional Sn-based binary/ternary solder,resulting in highly reliable solder joints.Recently,the interest in Sn-based alloys and composite solders has in-creased due to their improved mechanical performance.However,various concerns,such as high manu-facturing costs,microstructural heterogeneity,and incomplete reliability data.This paper reviews the lat-est research progress on Sn-based lead-free solders for microelectronic interconnection over the past five years,in particular Sn-based multi-element alloys and composite solders.First,the advantages and disadvantages of typical solder preparation methods are compared and discussed.Second,the effects of an alloying element or foreign reinforcement additions on the solder's microstructure,properties,and ther-momechanical reliability are summarized.Finally,this paper presents the main problems in preparing and investigating Sn-based lead-free solders and proposes tentative solutions.The aim is to provide an es-sential basis for understanding the current development and future research directions for fast-evolving future application scenarios.
microelectronic interconnectionSn-based lead-free soldermicrostructure and propertythermo-mechanical reliability
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维普
