摘要
随着新能源汽车和5G通信等技术的快速发展,钎料及其焊点作为微电子互连中最关键的环节,往往需要在频繁的温度交变环境中长期服役,其热-机械可靠性面临更高的要求.锡基无铅钎料自21世纪初开始得到快速的发展,大量基于合金化和材料复合的研究方法对锡基无铅钎料进行成分设计,以弥补传统锡基二元、三元钎料存在的问题,获得了具有高性能、高可靠性的焊点.本文综述了近年来微电子互连用锡基合金及复合钎料的最新研究进展,对比了几种常见的钎料制备方法的优势和不足,重点梳理了锡基合金钎料以及锡基复合钎料组织性能及热-机械可靠性的研究进展,并对今后锡基无铅钎料的研究与制造前景作出展望.
Abstract
Over the past few decades,electronic products have evolved towards miniaturization,in-telligence,and multi-functionality.With the rapid development of new energy vehicles and 5G mobile com-munication technologies,solder,the most commonly used interconnecting material in the microelectronic industry,may continuously undergo alternating temperature excursions.As a result,researchers have fo-cused on improving the thermomechanical reliability of solder joints.For several decades,researchers have widely studied Sn-based lead-free solder and have established that adding an alloying element or foreign reinforcement can overcome the limitations of traditional Sn-based binary/ternary solder,resulting in highly reliable solder joints.Recently,the interest in Sn-based alloys and composite solders has in-creased due to their improved mechanical performance.However,various concerns,such as high manu-facturing costs,microstructural heterogeneity,and incomplete reliability data.This paper reviews the lat-est research progress on Sn-based lead-free solders for microelectronic interconnection over the past five years,in particular Sn-based multi-element alloys and composite solders.First,the advantages and disadvantages of typical solder preparation methods are compared and discussed.Second,the effects of an alloying element or foreign reinforcement additions on the solder's microstructure,properties,and ther-momechanical reliability are summarized.Finally,this paper presents the main problems in preparing and investigating Sn-based lead-free solders and proposes tentative solutions.The aim is to provide an es-sential basis for understanding the current development and future research directions for fast-evolving future application scenarios.
基金项目
国家自然科学基金(52001013)
中国博士后科学基金(2022M710271)
北京市教育委员会科研计划项目(KZ202210005002)
北京市教育委员会科研计划项目(KM202310005011)
维普
万方数据