Improvement and quality control of chemical copper plating process for solid welding wire
In traditional process of copper plating on welding wire surface,there are two shortcomings:it is not easy to ob-tain uniform and stable copper plating layer quality,and it is difficult to correct copper plating solution.By increasing fer-rous sulfate in copper plating solution,the rapid formation of copper is inhibited to obtain good copper plating adhesion.A supplementary liquid sub-tank composed of copper sulfate and sulfuric acid was added to realize water addition and correc-tion of copper plating solution.In copper plating process,quality control focus is control of each component content of cop-per plating solution,management chart of each component concentration of copper plating solution is given.
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