首页|无色透明聚酰亚胺的研究进展

无色透明聚酰亚胺的研究进展

扫码查看
随着柔性光电器件的快速发展,对无色透明聚合物薄膜类柔性基材的性能要求越来越高.其中,作为高分子材料"金字塔"尖的聚酰亚胺(PI)因其优异的耐热性、机械性能、化学稳定性及介电性能成为最有力的候选者.因此,在保持传统有色PI优势性能的基础上,如何实现PI的无色透明化成为近些年的研究热点.本文分别从制备(包括制备方法和溶剂)和分子结构设计(如引入强电负性基团、脂环结构和大体积侧基等)两个方面,讨论了它们对无色透明PI(CPI)关键性能指标的影响,并进行了展望.
Research Progress of Colorless and Transparent Polyimide Film
With the rapid development of flexible optoelectronic devices,the performance requirements of flexible substrates based on colorless transparent polymer films are becoming higher and higher.Among them,polyimide(PI),as the tip of the pyramid of polymer materials,is the most powerful candidate because of its excellent heat resistance,mechanical properties,chemical stability and dielectric properties.Therefore,on the basis of maintaining the advantages of traditional colored PI,how to achieve colorless and transparent PI had become a research hotspot in recent years.In this paper,the effects on the key properties of colorless transparent PI(CPI)were discussed,from the aspects of molecular structure design(such as introduction of strong electronegative groups,alicyclic structure and large volume side groups,et al.)and preparation(including preparation method and solvent).And it was summarized and prospected.

PolyimideColorless and TransparentFilmPreparationMolecular Structure Design

牛翔、贺娟、陈文求、陈伟、余洋、范和平

展开 >

湖北省化学研究院,江汉大学,武汉 430056

华烁科技股份有限公司,武汉 430074

华烁电子材料(武汉)有限公司,湖北鄂州 436070

聚酰亚胺 无色透明 薄膜 制备 分子结构设计

2024

胶体与聚合物
湖北大学

胶体与聚合物

影响因子:0.259
ISSN:1009-1815
年,卷(期):2024.42(1)
  • 38