A review on adhesion behavior of chip seal pavement and aggregate

扫码查看

原文链接

NETL
NSTL
万方数据

外文摘要：Chip seal is widely used for preventive maintenance to mitigate pavement deterioration,but it is prone to aggregate loss during pavement service.To further promote the devel-opment and application of chip seals in road engineering in China,the research progress of the adhesion behavior of aggregate and binder in chip seals was reviewed in this paper,focusing on the adhesion mechanism of emulsified asphalt and alkaline aggregate.The Influencing factors and evaluation methodology of chip seals'aggregate adhesion behavior were also discussed.The results demonstrate that the adhesion process between emulsi-fied asphalt and alkaline aggregate is divided into three processes including infiltration,demulsification,and cluster,which is more complicated when compared to hot asphalt.When designing a chip seal,not only the characteristics of single material should be paid attention to,but also the combination of binder and aggregate matters a lot.To form good adhesion between aggregate and asphalt binder,various influencing factors such as ma-terial selection,design method,and construction technical index should be considered comprehensively in the whole design,construction,and operation process.Three methods for evaluating adhesion behavior are summarized,including macroscopic adhesion per-formance tests,image analysis technology,and model prediction.It is not objective to evaluate the aggregate adhesion behavior of chip seal only by a single evaluation method.A comprehensive evaluation based on the micro-macro multi-scale method should be considered in the future.

外文关键词：

Chip sealAdhesion behaviorAsphalt binderAggregate

作者：

Yuming Zhou、Zhuyi Peng、Jinyu Wang、Jianguo Wei、Hao Liu、Di Wang、Jinming Li

展开 >

作者单位：

Key Laboratory of Road Structure and Material of Ministry of Transport(Changsha),Changsha University of Science and Technology,Changsha 410114,China

School of Traffic and Transportation Engineering,Changsha University of Science and Technology,Changsha 410114,China

Wuhan Huike Testing Co.,Ltd.,Wuhan 430000,China

Department of Civil Engineering,University of Ottawa,ON KIN 6N5,Canada

CCCC Infrastructure Maintenance Group Co.,Ltd.,Beijing 100102,China

展开 >

基金：

National Natural science Foundation of ChinaOpen Fund of Key Laboratory of Road Structure and Material of Ministry of Transport(Changsha University of Science and Technolog

项目编号：

52108396kfj210301

出版年：

2024

DOI：

10.1016/j.jtte.2023.11.003

交通运输工程学报(英文版)

CSTPCD

ISSN：2095-7564

年,卷(期)：2024.11(3)