中国机械工程学报2024,Vol.37Issue(3) :104-117.DOI:10.1186/s10033-024-01038-0

Research on the Encapsulation Device for Lunar Samples

Yonggang Du Chunyong Wang Haoling Li Ying Zhou Ming Ji Xuesong Wang
中国机械工程学报2024,Vol.37Issue(3) :104-117.DOI:10.1186/s10033-024-01038-0

Research on the Encapsulation Device for Lunar Samples

Yonggang Du 1Chunyong Wang 1Haoling Li 1Ying Zhou 1Ming Ji 1Xuesong Wang1
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作者信息

  • 1. Lanzhou Institute of Physics,CAST,Lanzhou 730000,China
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Abstract

The encapsulation of lunar samples is a core research area in the third phase of the Chinese Lunar Exploration Pro-gram.The seal assembly,opening and closing mechanism(OCM),and locking mechanism are the core components of the encapsulation device of the lunar samples,and the requirements of a tight seal,lightweight,and low power make the design of these core components difficult.In this study,a combined sealing assembly,OCM,and locking mechanism were investigated for the device.The sealing architecture consists of rubber and an Ag-In alloy,and a the-ory was built to analyze the seal.Experiments of the electroplate Au coating on the knife-edge revealed that the her-metic seal can be significantly improved.The driving principle for coaxial double-helical pairs was investigated and used to design the OCM.Moreover,a locking mechanism was created using an electric initiating explosive device with orifice damping.By optimizing the design,the output parameters were adjusted to meet the requirements of the lunar explorer.The experimental results showed that the helium leak rate of the test pieces were not more than 5 × 10-11 Pa·m3·s-1,the minimum power of the OCM was 0.3 W,and the total weight of the principle proto-type was 2.9 kg.The explosive driven locking mechanism has low impact.This investigation solved the difficulties in achieving tight seal,light weight,and low power for the lunar explorer,and the results can also be used to explore other extraterrestrial objects in the future.

Key words

Lunar samples/Encapsulation/Vacuum seal/Mechanism

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基金项目

Research Foundation of CLEP of China(TY3Q20110003)

出版年

2024
中国机械工程学报
中国机械工程学会

中国机械工程学报

CSTPCD
影响因子:0.765
ISSN:1000-9345
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