Study on the Brazing Mechanism and Mechanical Properties of Glass-Copper Joining Process Based on Anodic Bonding
The bonding process of the glass and copper was successfully achieved by an anodic bonding and brazing process using Sn-9Zn-3Bi solder and an aluminum foil.The microstructure of the glass-Al-solder-Cu joint was observed by using a scanning electron microscope.The effect of brazing temperature and brazing time on the bonding process and the interfacial microstructure between solder and aluminum copper was studied,it had been found that the aluminium foil was gradually consumed with the increase of the brazing time.The aluminum foil was consumed completely in 15 min at 240 ℃.The Cu5Zn8 and CuZn5 intermetallic compound layer was sequentially formed with the increment of the brazing time at 240 ℃,and the CuZn5 intermetallic compound layer was gradually increased.The width of CuZn5 intermetallic compound layer becomes uniform gradually.It was found that as the brazing temperature increased,the aluminium foil was also gradually consumed and the thickness of the intermetallic layer generated at the interface also gradually increases,and the jagged shape of the CuZn5 intermetallic layer became more obvious.Through shear test,it has been found that the shear strength of the glass-Cu joint increased initially,then decreased,with a maximum of 20.29 MPa.The fracture occurred at the glass substrate,indicating the reliable bonding technology.
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