首页|非线性电导调制SiC/环氧树脂绝缘涂层热氧/湿热老化研究

非线性电导调制SiC/环氧树脂绝缘涂层热氧/湿热老化研究

扫码查看
高压电力电子器件的发展对其绝缘封装提出了更高要求.提出一种可以提升功率器件高压绝缘性能的非线性电导调制绝缘涂层,并对其性能进行研究分析.首先研究了非线性电导调制SiC/环氧树脂复合材料的制备工艺方法,并研究了材料电导率随电场强度及温度的变化规律.之后采用非线性电导调制SiC/环氧树脂作为绝缘涂层封装器件,通过有限元电场仿真结合试验的方法,验证了复合材料对器件局部放电性能的改善效果,结果表明采用非线性电导调制SiC/环氧树脂封装的器件的电场峰值相较于对照组降低了 38.6%,且局部放电试验结果表明,非线性电导调制SiC/环氧树脂绝缘涂层可以将器件的局部放电起始电压提升44.9%以上.最后,对非线性电导调制SiC/环氧树脂绝缘涂层的长期可靠性进行了研究,通过热氧老化与湿热老化试验对其长期绝缘可靠性进行了试验验证,并从微观机理对试验结果进行分析.最终结果表明,采用非线性电导调制SiC/环氧树脂涂层封装的功率器件长期绝缘可靠性仍优于对照组.
Thermo-oxygen/Hygrothermal Aging of SiC/Epoxy Resin Composite as an Insulating Coating with Nonlinear Conductivity
The advancement of high-voltage power electronic devices had increased the demands placed on their insulating packages.To increase the insulation performance of the device,a type of insulation coating with nonlinear conductivity was proposed in this study,and the performance was analyzed.Firstly,the preparation process of the SiC/epoxy composite was studied,and the variation of electrical conductivity with electric field intensity and the temperature was analyzed.The device was prepared with the composite as an insulating coating around the edge of the copper metallization on the substrate.Through finite element electric field simulation,the electric field peak of the device with the insulating coating was found to be 38.6%lower than that of the device without the coating.The partial discharge test found that the partial discharge initiation voltage of encapsulated device using the insulating coating increased by 44.9%.Finally,the long-term reliability of composite was studied.Thermo-oxygen aging,hygrothermal aging and microscopic mechanism were analyzed.The final results show that the long-term insulation reliability of the power device encapsulated by the SiC/epoxy composite was better than that of the control group.

nonlinear conductive coatingpartial dischargeinsulation materialpower devicepackage

梁玉、陆国权、梅云辉

展开 >

天津大学材料科学与工程学院 天津 300350

弗吉尼亚理工大学电气与计算机工程系 黑堡镇24061美国

天津工业大学电气工程学院 天津 300387

非线性电导涂层 局部放电 绝缘材料 功率器件 封装

国家自然科学基金国家自然科学基金国家自然科学基金

U19662125192207551877147

2024

机械工程学报
中国机械工程学会

机械工程学报

CSTPCD北大核心
影响因子:1.362
ISSN:0577-6686
年,卷(期):2024.60(6)
  • 33