Recent Development and Prospective of Double-sided Lapping Technology
In recent years,semiconductor and optical manufacturing fields have experienced rapid development,leading to a heightened demand for thin flat components,such as wafers,optical windows,and sealing rings.Consequently,the quality requirements for their processing have become increasingly rigorous.Double-sided lapping is a widely used method for processing thin flat components,due to its low processing stress and high efficiency.To provide a comprehensive review of the current status of double-sided lapping,this study focuses on examining the mechanisms,processes,applications,and recent research developments in equipment.Additionally,the optimization effects of theoretical models on the double-sided lapping process are analyzed,and the current application status is summarized.Moreover,this study thoroughly compares the advantages and disadvantages of representative double-sided lapping equipment from various manufacturers in the industry,highlighting the gap between domestic and international equipment.The findings of this analysis offer a valuable reference for future research in the field and present a projection of the development trends of double-sided lapping technology.
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