双面研磨技术研究现状与发展趋势
Recent Development and Prospective of Double-sided Lapping Technology
郭江 1潘博 1连佳乐 1杨哲 1刘欢 1高菲 1康仁科1
作者信息
- 1. 大连理工大学高性能精密制造全国重点实验室 大连 116024
- 折叠
摘要
近年来,随着半导体、光学制造等领域的飞速发展,对晶圆、光学窗口及密封环等薄平板件的需求越来越大,加工质量要求越来越高.双面研磨具有加工应力小、效率高等优点,被广泛用于薄平板件的加工.为梳理双面研磨技术发展现状,重点综述了双面研磨的机理、工艺、应用及装备的最新研究进展;分析了双面研磨理论模型对工艺的优化效果,总结了双面研磨工艺的应用现状.此外,全面比较了行业内代表性厂家双面研磨装备的技术水平,并指出了国内与国外的差距.在此基础上,对双面研磨技术的发展趋势进行了展望,为后续相关研究提供了参考.
Abstract
In recent years,semiconductor and optical manufacturing fields have experienced rapid development,leading to a heightened demand for thin flat components,such as wafers,optical windows,and sealing rings.Consequently,the quality requirements for their processing have become increasingly rigorous.Double-sided lapping is a widely used method for processing thin flat components,due to its low processing stress and high efficiency.To provide a comprehensive review of the current status of double-sided lapping,this study focuses on examining the mechanisms,processes,applications,and recent research developments in equipment.Additionally,the optimization effects of theoretical models on the double-sided lapping process are analyzed,and the current application status is summarized.Moreover,this study thoroughly compares the advantages and disadvantages of representative double-sided lapping equipment from various manufacturers in the industry,highlighting the gap between domestic and international equipment.The findings of this analysis offer a valuable reference for future research in the field and present a projection of the development trends of double-sided lapping technology.
关键词
双面研磨技术/材料去除/工艺优化/双面研磨装备Key words
double-sided lapping process/material removal/process optimization/double-sided lapping equipment引用本文复制引用
基金项目
国家重点研发计划(2022YFB3403300)
出版年
2024
NETL
NSTL
万方数据