首页|激光-微铣削复合加工氧化铝共烧基板基础研究

激光-微铣削复合加工氧化铝共烧基板基础研究

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基于氧化铝共烧基板难加工问题,提出激光辅助微铣削的复合加工方法.研究了纳秒激光加工氧化铝共烧基板的形貌、尺寸以及残留变质层机械特性之后进行铣削试验.结果表明,紧密结合的氧化铝颗粒在激光的作形成疏松的变质层附在基体表面.槽的刻蚀深度随激光功率的增加和扫描速度、填充间距的减小分别在170~537 μm、167~493 μm和170~303 μm有着不同程度的增加,而刻蚀宽度在515~643 μm内变化.激光改性后基板残留变质层的整体硬度降低82%~96.2%,最小可达53.9 HV.与纯铣削相比,激光-微铣削后刀具使役性能提高,切削刃和刀具轮廓基本完整,且加工后表面粗糙度降低60%~65%,最小达 0.204 μm.
Fundamental Research on Laser-micro Milling Hybrid Processing of Alumina Co-fired Substrate
Based on the difficult processing problem of Al2O3 HTCC,a hybrid processing method of laser-micro milling is proposed.The morphology,dimensions and mechanical properties of the residual metamorphic layer of nanosecond laser-machined aluminum oxide co-fired substrates are investigated followed by milling tests.The results show that the tightly bound alumina particles form a loose metamorphic layer attached to the substrate surface under laser action.The etching depth of the grooves increases with the increase of laser power and the decrease of scanning speed and filling spacing in different degrees between 170-537 μm,167-493 μm and 170-303 μm,respectively,while the etching width varies between 515-643 μm.The overall hardness of the residual metamorphic layer of the substrate after laser modification was reduced by 82%-96.2%down to 53.9 HV.Compared to pure milling,the laser-micro-milling resulted in improved tool serviceability,largely intact cutting edges and tool profiles,and a reduction in the post-processing surface roughness by 60%-65%down to 0.204 μm.

Al2O3 HTCClaser processingmicro millinghybrid processing

王子鸣、侯清健、许立讲、王越飞、肖何、陈妮、李亮

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南京电子技术研究所 南京 210039

南京航空航天大学机电学院 南京 210016

氧化铝基板 激光加工 微铣削 复合加工

2024

机械工程学报
中国机械工程学会

机械工程学报

CSTPCD北大核心
影响因子:1.362
ISSN:0577-6686
年,卷(期):2024.60(21)