通过在陶瓷表面镀铜将陶瓷表面金属化,然后在温度227℃、压强0.04M P a、保温2min条件下,使用Sn99Ag0.3Cu0.7焊锡膏将镀铜陶瓷与铜进行钎焊,并通过光学显微镜、扫描电镜对钎焊接头进行观察分析.试验结果表明:铜合金和陶瓷在低温下钎焊能够形成金属化合物层,实现有效焊接,钎焊接头强度可达13.2MPa.
Research on low-temperature brazing joints of copper and ceramics
The ceramic surface was metallized by copper plating on the ceramic surface.Sn99Ag0.3Cu0.7 solder paste was used to braze the copper plated ceramic with copper under the condition of a temperature of 227℃and insulation for 2minutes.The brazed joint was observed and analyzed using an optical microscope and a scanning electron microscope.The experimental results show that copper alloy and ceramic can form a metal compound layer through brazing at low temperatures,achieving effective welding.The strength of the brazed joint is 13.2MPa.
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