Research on low-temperature brazing joints of copper and ceramics
王发 1刘美川 1陈炫如 2李佳萍 2周嘉玲 2于学勇 2戴军2
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作者信息
1. 锐新昌科技(常熟)有限公司 江苏常熟 215500
2. 常熟理工学院汽车工程学院 江苏常熟 215500
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摘要
通过在陶瓷表面镀铜将陶瓷表面金属化,然后在温度227℃、压强0.04M P a、保温2min条件下,使用Sn99Ag0.3Cu0.7焊锡膏将镀铜陶瓷与铜进行钎焊,并通过光学显微镜、扫描电镜对钎焊接头进行观察分析.试验结果表明:铜合金和陶瓷在低温下钎焊能够形成金属化合物层,实现有效焊接,钎焊接头强度可达13.2MPa.
Abstract
The ceramic surface was metallized by copper plating on the ceramic surface.Sn99Ag0.3Cu0.7 solder paste was used to braze the copper plated ceramic with copper under the condition of a temperature of 227℃and insulation for 2minutes.The brazed joint was observed and analyzed using an optical microscope and a scanning electron microscope.The experimental results show that copper alloy and ceramic can form a metal compound layer through brazing at low temperatures,achieving effective welding.The strength of the brazed joint is 13.2MPa.
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