Research on the Application of New Ammonia-free Microetchant in Etching Process
Microetchants,which are widely used in the etching process of printed circuit boards,present significant challenges in wastewater treatment due to their ammonia-nitrogen content.The microetching effects were characterized,and the microetching performance of a novel ammonia-free microetchant developed in a sulfuric acid-hydrogen peroxide system was evaluated.Experimental results show that the microetched copper surface exhibits excellent cleanliness and brightness,excellent surface morphology,uniform particle distribution and moderate roughness.The microetchant has a copper ion tolerance rate of up to 40.0 g/L,and its rate is maintained stably between 0.6～1.5 μm/min.The ammonia-free microetchant shows advantages in nickel plating rate and uniformity of the copper-clad laminates compared to the industry's leading microetchant.Ammonia-free microetchants not only offer excellent process performance,but also reduce the complexity and cost of wastewater treatment,thereby decreasing the environmental impact of industrial production.
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