新型无氨氮微蚀剂在蚀刻工艺中的应用研究
Research on the Application of New Ammonia-free Microetchant in Etching Process
徐正武 1张添淳 2吴康志 2周宇阳 2吴道新2
作者信息
- 1. 益阳市明正宏电子有限公司,湖南益阳 413001
- 2. 长沙理工大学化学化工学院,湖南长沙 410114
- 折叠
摘要
在印刷电路板(PCB)的蚀刻工艺中广泛使用的微蚀剂因含有氨氮成分面临十分困难的废水处理问题.在硫酸-过氧化氢体系中研发了一款新型无氨氮微蚀剂,表征了其微蚀效果,并评估了其微蚀性能.结果表明,微蚀处理后的铜面清洁度和光亮度好,表面形貌优异,颗粒分布均匀,粗糙度适中.该微蚀剂具有高达40.0 g/L的铜离子容忍率,其速率稳定维持在0.6～1.5μm/min之间.与行业内领先的微蚀剂相比,这款无氨氮微蚀剂处理的覆铜板在镀镍速率和均匀性方面均显示出优势.无氨氮微蚀剂不仅具有优秀的工艺性能,还降低了废水处理的复杂性和成本,减少了工业生产对环境的影响.
Abstract
Microetchants,which are widely used in the etching process of printed circuit boards,present significant challenges in wastewater treatment due to their ammonia-nitrogen content.The microetching effects were characterized,and the microetching performance of a novel ammonia-free microetchant developed in a sulfuric acid-hydrogen peroxide system was evaluated.Experimental results show that the microetched copper surface exhibits excellent cleanliness and brightness,excellent surface morphology,uniform particle distribution and moderate roughness.The microetchant has a copper ion tolerance rate of up to 40.0 g/L,and its rate is maintained stably between 0.6～1.5 μm/min.The ammonia-free microetchant shows advantages in nickel plating rate and uniformity of the copper-clad laminates compared to the industry's leading microetchant.Ammonia-free microetchants not only offer excellent process performance,but also reduce the complexity and cost of wastewater treatment,thereby decreasing the environmental impact of industrial production.
关键词
蚀刻/无氨氮/硫酸-过氧化氢体系/微蚀剂/镀镍浸金Key words
etch/ammonia-free/sulfuric acid-hydrogen peroxide system/microetchant/nickel dip gold plating引用本文复制引用
出版年
2024
NETL
NSTL
万方数据