Optimization Design and Sound Field Radiation Simulation of Photolithography Mold Megasonic Cleaning Transducers Based on Comsol
In the cleaning of lithography molds,megasonic technology has demonstrated its unique advantages.Megasonic cleaning can remove tiny particles smaller than 0.2 μm and avoid damage to the surface of the object that may be caused by cavitation.However,there are significant differences in the water acoustic field distribution of megasonic cleaning transducers with different matching layers,and there is currently little research on megasonic cleaning transducers.In order to further improve the cleaning efficiency of the photolithography mold megasonic cleaning transducer,increase the sound pressure transmitted into the water,and reduce the loss during energy transfer,firstly,the method of ultrasound is drawn to design the transducer as a whole.Then,the finite element software Comsol is used to analyze the water acoustic field of the photolithography mold megasonic cleaning transducer.The acoustic piezoelectric interaction module in Comsol is used to study its influence on the water acoustic pressure of the photolithography mold megasonic cleaning transducer by changing the matching layer material and size.Based on the analysis results,the photolithography mold megasonic cleaning transducer is optimized and designed.The optimization results show that using 5 mm quartz as the matching layer for the spray type megasonic cleaning transducer results in better sound field stability in water,and the maximum sound pressure amplitude is 150 kPa between propagation distances of 20～40 mm.
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