首页|碳化硅陶瓷的激光改性磨削

碳化硅陶瓷的激光改性磨削

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  • 国家科技期刊平台
  • NETL
  • NSTL
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  • 维普
为了实现碳化硅陶瓷的高精加工,激光辐照被引入磨削加工中.本文以碳化硅陶瓷为研究对象,采用激光改性磨削工艺,利用激光辐照对碳化硅陶瓷进行改性处理,进而对碳化硅陶瓷进行磨削试验.与普通磨削进行比较,研究了碳化硅陶瓷试样的磨削力、表面粗糙度、表面形貌和亚表面损伤.实验结果表明,与普通磨削相比,激光改性磨削可以有效降低法向磨削力、切向磨削力、表面粗糙度,最大下降幅度分别为 33.91%、37.31%和33.14%.激光改性磨削促使 SiC 陶瓷在磨削过程中以塑性去除为主,磨削表面规则且光滑;工件亚表面微裂纹较少,亚表面损伤深度小;实现了大磨削深度的塑性去除,提高了 SiC陶瓷的磨削质量.
Laser Modified Grinding of Silicon Carbide Ceramics
In order to realize high-precision machining of SiC ceramics,laser irradiation is introduced into the grinding process.In this paper,SiC ceramics as research material,by using laser modified grinding(LMG)process,and then the grinding experiments of SiC ceramics modified by laser irradiation were carried out.Comparing with the ordinary grinding(OG),the grinding force,surface roughness,surface morphology and subsurface damage of SiC ceramic samples were studied.The experimental results show that LMG can effectively reduce normal grinding force,tangential grinding force and surface roughness,and the maximum decreases are 33.91%,37.31%and 33.14%,respectively.LMG promotes the plastic removal of SiC ceramics in the grinding process,and the grinding surface is regular and smooth.There are fewer micro-cracks on the workpiece subsurface,and the subsurface damage depth is small.The plastic removal with a large grinding depth is realized,and the grinding quality of SiC ceramics is improved.

silicon carbide ceramicslaser modified grindinggrinding forcesurface qualityplastic removal

刘伟、顾浩、唐都波、刘顺

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湖南科技大学 机电工程学院,湖南湘潭 411201

湖南科技大学 难加工材料高效精密加工湖南省重点实验室,湖南湘潭 411201

碳化硅陶瓷 激光改性磨削 磨削力 表面质量 塑性去除

国家自然科学基金国家自然科学基金湖南省自然科学基金湖南省自然科学基金湖南省自然科学基金湖南省教育厅科研项目

U23A20634515051442023JJ302512020JJ51782020JJ402420A202

2024

10.13433/j.cnki.1003-8728.20220243

机械科学与技术
西北工业大学

机械科学与技术

CSTPCD北大核心
影响因子：0.565
ISSN：1003-8728
年,卷(期)：2024.43(4)
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