首页|硫酸高铈添加剂对超薄电解铜箔结构和力学性能的影响

硫酸高铈添加剂对超薄电解铜箔结构和力学性能的影响

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为提升超薄电解铜箔的力学性能,通过在电解液中添加不同质量浓度的硫酸高铈,研究其对超薄电解铜箔结构和力学性能的影响.结果表明:当Ce(SO4)2质量浓度为15mg/L时,所制备的超薄电解铜箔抗拉强度为457 MPa,延伸率为5.23%,较未添加的电解铜箔抗拉强度和延伸率分别提升了 16%和78%,这是因为Ce(SO4)2的加入增大了铜电沉积过电位,加快了铜离子在阴极表面扩散速率,Ce4+为Cu2+的沉积提供了活性位点,使得铜晶核大量生成,抑制铜晶体生长,细化铜晶体晶粒大小.Ce(SO4)2的加入可改善超薄电解铜箔形貌结构以及提升其力学性能.
Effect of Ce(SO4)2 Additives on The Structure and Performance of Ultra-Thin Electrolytic Copper Foil
In order to improve the mechanical properties of ultrathin electrolytic copper foil,the effects of Ce(SO4)2 with different mass concentrations in the electrolyte on the structure and mechanical properties of ultrathin electrolytic copper foil were studied.The results show that,when Ce(SO4)2 mass concentration was 15 mg/L,the tensile strength of the prepared electrolytic copper foil is as high as 457 MPa,which is increased by 16%,and the elongation is increased to 5.23%and 78%.This is because the addition of Ce(SO4)2 increases the overpotential of copper electrodeposition,accelerates the diffusion rate of copper ions on the surface of the cathode,and Ce4+provides active sites for the deposition of Cu2+,which leads to the generation of a large number of copper nuclei,inhibits the growth of copper crystals,refines the size of copper grains,and the addition of Ce(SO4)2 improves the morphology and structure of the ultra-thin electrolytic copper foils as well as enhances their mechanical properties.

rare earth additiveshigh cerium sulfateultra-thin electrolytic copper foilmechanical properties

李世杰、李建新、高中琦、陈小平、谢长江、李衔洋、贾万泽

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天津工业大学材料科学与工程学院,天津 300387

江西省科学院能源研究所,南昌 330096

江西铜博科技股份有限公司,江西抚州 344099

稀土添加剂 硫酸高铈 超薄电解铜箔 力学性能

国家自然科学基金项目江西省科学院包干制项目江西省科学院包干制项目

222783182021YSBG500022023YSBG21007

2024

能源研究与管理
江西省能源研究会 江西省科学院能源研究所 江西省经贸委节能技术中心

能源研究与管理

影响因子:0.207
ISSN:1005-7676
年,卷(期):2024.16(3)
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