Heat dissipation structure design and experimental tests of an electronic equipment chassis
Aiming at the requirements of internal heat dissipation and aesthetically pleasing and compact form of an electron-ic device,the thermal simulation software Flotherm was used to simulate the temperature field of a medical electronic device.Based on the simulation results,the improvements were proposed such as adding a GPU cooling backplane,setting ventilation holes in the upper part of the chassis,adding ventilation grilles in the lower part of the case and adding fans.An optimal cooling solution for the device was finally obtained through comprehensive analysis and comparison.The design of the chassis was improved ac-cording to the thermal solution,resulting in a harmonious design between thermal structure and appearance.The comparison re-sults between measured temperature data and improved thermal simulation results showed that the temperature difference between the main heat generating devices in the medical electronic equipment was within an acceptable range through thermal experiments on the actual prototype under the same operating conditions,which verified the correctness of the thermal design.The design en-hanced the operational stability and reliability of the device and provided references for thermal design of similar medical electron-ic devices.
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