基于往复弯曲的焊点可靠性测试装置设计
Design of solder-joint reliability test device based on reciprocal bending
张怀权 1黄春跃 1廖帅冬 1龚锦锋1
作者信息
- 1. 桂林电子科技大学机电工程学院,广西桂林 541004
- 折叠
摘要
针对因机械外力造成微电子器件焊点连接缺陷导致整个焊点失效,进而影响电子产品正常工作的现象,文中设计了一款基于往复弯曲的焊点可靠性测试装置,用于元器件焊点机械性能的可靠性测试.首先,根据测试装置功能设计了装置机械结构,并采用SolidWorks软件建立三维模型,验证了设计方案的可行性;其次,通过分析装置传动结构的运动学方程,从运动学上验证了传动机构设计结构的合理性;最后,采用ADAMS软件建立传动结构动力学模型进行仿真,从动力学上验证了传动机构的合理性,采用ANSYS软件建立夹持、施压机构模型对印制线路板进行静弯曲仿真,验证了弧形夹持机构和弧形施压机构的合理性.
Abstract
;The mechanical external force caused by the microelectronic device's solder-joint connection defects lead to the entire solder joint's failure and even affect the electronic product's normal operation.In this article,a solder-joint reliability test device based on reciprocal bending is designed to conduct the reliability test on the solder joint's mechanical performance.First-ly,the device's mechanical mechanism is designed according to its function,and the 3D model is set up with the help of Solid-Works,and it is verified that this design is feasible.Secondly,by analyzing the kinematic equation of the device's transmission mechanism,it is verified from the kinematics that the design is rational.Finally,the transmission mechanism's dynamic simula-tion model is worked out by means of ADAMS for sake of dynamic simulation,and it is verified from the dynamics that the design is rational.The simulation models of the clamping mechanism and the pressing mechanism are set up by ANSYS,so as to conduct the static bending simulation on the printed circuit board,and it is verified that both the arc clamping mechanism and the arc pressing mechanism are designed in a rational manner.
关键词
微电子器件/焊点失效/机械性能/可靠性测试Key words
microelectronic device/solder-joint failure/mechanical performance/reliability test引用本文复制引用
出版年
2024
NETL
NSTL
万方数据