Simulation Study on the Effect of Hole Defect on TC4 Machining
In order to study the influence of the cutting of TC4 material caused by hole defects,the finite element cutting simula-tion method is used to study the characteristics and rules of stress-strain,chip shape and cutting force in the cutting process.Through thermal-mechanical coupling simulation,data analysis,time-frequency analysis and other methods to make the re-search on the parameters in the cutting process of defective materials,the research results show that:Firstly,according to defect located on the cutting path,stress concentration appears on the surface of the defect after cutting and then the surface stress value of the mentioned defect is significantly reduced compared with the situation when there is no defect;Secondly,when the defect is only situated in the surface,the defect leads to the changes in the internal structure of the material,chip fractures,and violent changes in chip shape;Thirdly,when the defect is on the both cutting path and the surface,reaching to the defect,it is found that the cutting force changes abruptly,the cutting becomes unstable,and the defect in the surface has the greatest impact on the sudden changes of the cutting force;Finally,the Choi-Williams time-frequency analysis is used to analyze the cutting force sig-nals obtained from the cutting simulation with different positions of defects,and the time-frequency signals of the cutting force fluctuations in the case of different positions of defects are observed to judge the position of the defect.
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