Influence of fine-tuning texture on bending properties of C7025 copper alloy strip
C7025 copper alloy is widely used in high-end electronic materials due to its high strength,excellent electrical conductivity.In recent years,with the demand for ultra-thin electronic products,the strength requirement has become higher and higher,and the bending property must also be guaranteed,therefore,the process optimization is particularly important.The influence of fine-tuning texture on the bending property of C7025 copper alloy strip was studied by adding a tension leveling in the traditional process,using optical microscopy,scanning electron microscopy,and electron back scatter diffraction technology.The research results show that the grain size,strength,elongation,microhardness,and electrical conductivity of the samples before and after the tension leveling process were basically the same,but there were differences in bending property in the rolling direction and width direction.After the tension leveling process,the copper alloy strip had a better bending property in the width direction and a worse bendability in the rolling direction,showing a strong anisotropy.This is because the tension leveling process caused a small amount of plastic deformation,changing the orientation of some grains.The{123}<634>(S)deformation texture in the copper alloy strip was enhanced,the original{112}<111>(Copper)grain orientation shifted,and a stronger{112}<132>texture component formed,resulting in a better bending property in the width direction than in the rolling direction.The research findings provided theoretical basis for adjusting actual production processes.
万方数据
维普
