首页|增强体表面改性在高导热金属基复合材料中的应用

增强体表面改性在高导热金属基复合材料中的应用

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  • 国家科技期刊平台
  • NETL
  • NSTL
  • 万方数据
随着电子技术的高速发展和电子器件的更新换代,电子封装材料的性能需求越来越高.金属基复合材料,尤其是铝基和铜基复合材料具有高导热、低膨胀、高稳定性等特点,是具有广阔应用前景的电子封装材料.然而,金刚石、石墨烯、硅等增强体与基体的润湿性差,或者在高温下与基体发生有害的界面反应,限制了此类高导热金属基复合材料的开发和应用.本文简述了金属基复合材料的界面研究进展,结合影响金属基复合材料界面结合的因素,提出了几种改善界面结合的方法.增强体表面改性是改善金属基复合材料界面的重要途径之一,常用工艺有磁控溅射法、化学气相沉积法、溶胶凝胶法、化学镀法等;最后,对增强体表面改性在高热导金属基复合材料中的应用进行分析和展望.
Application of surface modification of reinforcing phase in metal matrix composites with high thermal conductivity
With the rapid development of electronic technology and the upgrading of electronic devices,the requirement for electronic packaging materials is getting higher than before.Metal matrix composites,especially aluminum and copper matrix composites have the characteristics of high thermal conductivity,low expansion,and high stability,which are electronic packaging materials with broad application prospects.However,diamond,graphene,silicon,and other reinforcements have poor wettability with the matrix,or have harmful interface reaction with the matrix at high temperature,which limits the development and application of metal matrix composites with the high thermal conductivity.This paper briefly described the research progress of interface of metal matrix composites,and proposed several methods to improve the interface bonding based on the factors that affect the interface bonding of metal matrix composites.Surface modification of reinforcement is one of the most important ways to improve the interface of metal matrix composites.The common technologies include magnetron sputtering,chemical vapor deposition,sol-gel and electroless plating.Finally,the application of surface modification of reinforcement in metal matrix composites with high thermal conductivity was analyzed and prospected.

electronic packaging materialsmetal matrix compositesaluminum matrix compositescopper matrix compositesreinforcementinterface reactionsurface modification

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中南大学材料科学与工程学院,长沙 410083

湖南省电子封装与先进功能材料重点实验室,长沙 410083

中南大学轻质高强结构材料重点实验室,长沙 410083

电子封装材料 金属基复合材料 铝基复合材料 铜基复合材料 增强体 界面反应 表面改性

国家自然科学基金中国博士后科学基金湖南省自然科学基金轻质高强结构材料国防重点实验室开放基金

522743692018M6329862019JJ50766JCKY201851

2024

10.13264/j.cnki.ysjskx.2024.02.011

有色金属科学与工程
江西理工大学 江西省有色金属学会

有色金属科学与工程

CSTPCD北大核心
影响因子：0.751
ISSN：1674-9669
年,卷(期)：2024.15(2)
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