首页|添加剂对铜电沉积及铜箔力学性能的影响

添加剂对铜电沉积及铜箔力学性能的影响

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利用线性扫描伏安法及循环伏安剥离法研究了3-巯基-1-丙磺酸钠(MPS)、羟甲基纤维素、明胶及糖精钠对Cu电沉积的影响,并通过响应面法优化了添加剂对铜箔抗拉强度及延伸率影响的工艺条件.结果表明,羟甲基纤维素及明胶对铜电沉积具有抑制作用,且明胶的抑制作用优于羟甲基纤维素;MPS表现为促进作用,在浓度大于8 mg/L时,其促进作用不随浓度的改变而改变;糖精钠对铜电沉积无明显作用,与添加剂复配后,其促进或抑制效果介于单一添加剂之间.响应面结果表明,MPS、羟甲基纤维素及明胶浓度分别为4、8、6 mg/L时,铜箔的抗拉强度较优,且浓度为6、3、7 mg/L时延伸率最高.
Effect of additives on copper electrodeposition and mechanical properties of copper foil
In this paper,the effects of sodium 3-mercapto-1-propanesulfonate(MPS),hydroxymethyl cellulose,gelatin and sodium saccharin on Cu electrodeposition were investigated by linear scanning voltammetry and cyclic voltammetric analysis,and the effect of additives on the tensile strength and elongation of copper foil was optimized by response surface method.Hydroxymethylcellulose and gelatin have inhibitory effects on copper electrodeposition,and gelatin has a better inhibitory effect than hydroxymethylcellulose.MPS shows a promoting effect,and its promoting effect does not change with concentration when the concentration is greater than 8 mg/L.Saccharin sodium has no significant effect on copper electrodeposition,and when combined with additives,its promoting or inhibiting effect is between that of a single additive.The response surface results show that the optimal ratio for tensile strength is achieved when the concentrations of MPS,hydroxymethylcellulose,and gelatin are 4,8,6 mg/L,respectively,and the highest elongation is achieved when the concentrations are 6,3,7 mg/L.

electrolytic copper foilelectrochemical testingorganic additiveresponse surfacemechanical properties

樊斌锋、王绪军、赵玉龙、王庆福、李谋翠

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河南高精铜箔产业技术研究院有限公司,河南 灵宝 472500

三门峡市乡村振兴科技服务中心,河南 三门峡 472000

电解铜箔 电化学测试 有机添加剂 响应面 力学性能

2024

有色金属科学与工程
江西理工大学 江西省有色金属学会

有色金属科学与工程

CSTPCD北大核心
影响因子:0.751
ISSN:1674-9669
年,卷(期):2024.15(5)