空间电子技术2024,Vol.21Issue(1) :39-45.DOI:10.3969/j.issn.1674-7135.2024.01.007

梯度硅铝管壳回流焊接快速冷却热力仿真研究

Thermal simulation of rapid cooling for reflow welding of gradient Si-Al shell

李胜伟 冯晓晶 彭鑫 孙鹏 王凯
空间电子技术2024,Vol.21Issue(1) :39-45.DOI:10.3969/j.issn.1674-7135.2024.01.007

梯度硅铝管壳回流焊接快速冷却热力仿真研究

Thermal simulation of rapid cooling for reflow welding of gradient Si-Al shell

李胜伟 1冯晓晶 2彭鑫 2孙鹏 2王凯1
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作者信息

  • 1. 西安理工大学,西安 710048
  • 2. 中国空间技术研究院西安分院,西安 710000
  • 折叠

摘要

针对某航天电子管壳焊接组件冷却过程中的热力耦合影响问题,建立了焊接组件的有限元热分析模型,研究了在快速冷却过程中梯度材料分布对低温共烧陶瓷(low temperature co-fired ceramic,LTCC)基板、梯度管壳的残余应力和变形的影响.以不超过基板断裂强度为前提条件,以降低管壳整体的残余应力与变形为优化目标,采用了多因素变换优选法,确定了管壳材料的最优梯度分布方案,即合金管壳自上而下的梯度分布为Al-35Si、Al-42Si、Al-50Si、Al-60Si、Al-70Si.其中,Al-35Si厚度为2.5 mm,Al-42Si与Al-60Si的厚度均为1.6 mm,Al-50Si厚度为0.8 mm,Al-70Si厚度为2 mm.在该方案下,LTCC基板冷却至室温时的最大变形量为4.86 μm,最大第一主应力为6.761 MPa,远小于LTCC材料的断裂强度320 MPa;管壳冷却至室温时的最大变形量为18.291 μm,最大残余应力值为20.46 MPa,远小于管壳材料的屈服强度100 MPa.管壳各层之间的应力集中现象不明显,管壳的整体焊接质量得到提升.

Abstract

A finite element thermal analysis model was established to solve the problem of thermal coupling during the cooling process of an aerospace electronic tube shell welding component.The effect of gradient material distribution on the residual stress and deformation of Low Temperature Co-fired Ceramic(LTCC)substrate and gradient shell during rapid cooling has been investigated.Ensuring that the substrate's fracture strength is not exceeded and with the optimization goal of reducing the residual stress and deformation of the entire shell,a multifactor transformation preference method was employed to determine the optimal gradient distribution scheme for the shell material.Specifically,the gradient distribution of the alloy shell from top to bottom was set as Al-35Si,Al-42Si,Al-50Si,Al-60Si,and Al-70Si.The thicknesses of the layers were defined as follows:Al-35Si and Al-60Si,2.5mm;Al-42Si and Al-60Si,1.6 mm;Al-50Si,0.8 mm;and Al-70Si,2 mm.Under this optimized scheme,the maximum deformation of the LTCC substrate when cooled to room temperature was found to be 4.86 μm,with the maximum first principal stress at 6.761 MPa—significantly below the LTCC material's fracture strength of 320 MPa.Similarly,the maximum deformation of the shell when cooled to room temperature was measured at 18.291 μm,and the maximum residual stress value was 20.46 MPa,substantially smaller than the yield strength of the shell material at 100 MPa.The stress concentration among the layers of the shell is not obvious,and the overall welding quality of the shell has been improved.

关键词

回流焊/梯度硅铝管壳/基板/多因素变换优选法

Key words

reflow welding/gradient Si-Al shell/substrate/multifactor transformation preference method

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基金项目

国家研发课题(2022-JCJQ-LB-006)

出版年

2024
空间电子技术
西安空间无线电技术研究所

空间电子技术

影响因子:0.29
ISSN:1674-7135
参考文献量20
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