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集成电路产业上市公司高创新效率多元路径研究

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以2019-2021年我国上交所科创板集成电路产业38家上市公司为研究对象,基于TOE(技术-组织-环境)理论框架构建集成电路产业上市公司高创新效率6个前因变量.通过DEA(数据包络分析)测算得出的企业创新综合技术效率作为结果变量,从而运用fsQCA(模糊集定性比较分析法)进行企业高创新效率组态考察.研究结果表明,单一影响因素不能构成企业高创新效率影响路径,需要由两个或两个以上影响因素共同作用,形成外部资金驱动型、技术+外部资金驱动型、人才+外部资金驱动型、内外资金驱动型以及全面要素驱动型5条高创新效率影响路径.研究结果对集成电路产业相关企业提高创新效率具有一定参考意义.
Study on Multiple Paths of High Innovation Efficiency of Listed Companies in the Integrated Circuit Industry
38 listed companies in the integrated circuit industry of the Science and Technology Innovation Board of the Shanghai Stock Exchange of China from 2019 to 2021 is taken as the research object.Based on the TOE(technology organization environment)theoretical framework,six antecedents of high innovation efficiency of listed companies in the integrated circuit industry are constructed,and the comprehensive technological efficiency of enterprise innovation calculated by DEA(data envelopment analysis)is used as the outcome variable.Thus,fsQCA(fuzzy set qualitative comparative analysis)is used to investigate the configuration of high innovation efficiency in enterprises.The research results indicate that a single influencing factor cannot constitute a path for high innovation efficiency in enterprises.It requires two or more influencing factors to work together to form five high innovation efficiency impact paths:external funding driven,technology+external funding driven,talent+external funding driven,internal and external funding driven,and comprehensive factor driven.The results have certain reference significance for enterprises related to the integrated circuit industry to improve innovation efficiency.

listed companies in the integrated circuit industryTOE(technology organization environment)analysis frameworkfsQCA(fuzzy set qualitative comparative analysis)innovation efficiency

常明月、金春华

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北京信息科技大学经济管理学院,北京 100192

集成电路产业上市公司 TOE(技术-组织-环境)理论框架 fsQCA(模糊集定性比较分析法) 创新效率

北京市社会科学基金

19GLC073

2024

科技和产业
中国技术经济学会

科技和产业

影响因子：0.361
ISSN：1671-1807
年,卷(期)：2024.24(1)
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