首页|28nm体硅工艺FPGA BRAM脉冲激光试验及翻转特性

28nm体硅工艺FPGA BRAM脉冲激光试验及翻转特性

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针对SRAM型FPGA内部BRAM在轨出现翻转错误以及如何有效进行容错设计的问题,提出了测试BRAM空间单粒子效应和多位翻转图样的方法.多位翻转图样可以表征单次单粒子事件导致的BRAM中相邻单元的翻转特征,进而用于分析逻辑字内是否存在多位翻转.以XC7K410T-FFG900为研究对象,分析其内部资源的组织结构,采用脉冲激光试验测试BRAM的翻转特性.通过试验测得FPGA内BRAM的翻转阈值以及在不同激光能量下的翻转截面,并分析得到BRAM在不同能量照射下的多位翻转图样.试验结果表明,BRAM中单个单元翻转所占比例随激光能量的增加而降低,而多单元翻转所占比例随激光能量的增加呈上升趋势.BRAM在不同脉冲激光能量下可产生2 bit到11 bit的多单元翻转,但通过错误注入试验验证,该多单元翻转在单个字或者字节内并无多位翻转问题.研究结果为提高SRAM型FPGA在航天应用中的可靠性提供了试验支持,并依据BRAM的翻转特性给出了 SRAM型FPGA在轨加固方法和建议.
SEE Upset Characteristics of BRAM in 28 nm Bulk FPGA by Pulsed Laser Test
In order to get a well-targeted Single Event Upset(SEU)mitigation for block RAM in SRAM based FPGA,a method is proposed for researching the Single Event Effect(SEE)characteristics of FPGA and get the Multiple-Cell Upset(MCU)pattern which reveal the upset mode of adjacent cells in BRAM.Pulsed laser tests were performed on 28 nm bulk Kintex-7 XC7K410T-FFG900 FPGA after analyzing the structure of configurable frame in Kintex-7 serial FPGA.The Single-Cell Upset and Multi-ple-Cell Upset induced by pulsed laser were observed during the test,and the cross section under differ-ent laser energy was tested.Besides,the Multiple-Cell Upset patterns of BRAM in FPGA were analyzed.The result shows that the proportion of Multi-Cell Upset climbs up with the increasing laser energy,while the proportion of Single-Cell Upset goes in the opposite way.Two to eleven bits Multiple-Cell Up-set may be induced by one pulsed laser without Multiple-Bit Upset in any logical word or byte accord-ing to the error injecting test result.Some SEE mitigation methods were suggested according to the re-sults of SEE tests to improve the reliability of SRAM based FPGA in space application.

Single event effectPulsed laserMultiple-Cell Upset(MCU)BRAM upset patternSEU fault-tolerant

薛国凤、周昌义、安军社、吴昊、王天文

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中国科学院国家空间科学中心 北京 100190

中国科学院大学 北京 100049

单粒子效应 脉冲激光 多单元翻转(MCU) BRAM翻转图样 单粒子翻转容错

2024

空间科学学报
中国科学院空间科学与应用研究中心 中国空间科学学会

空间科学学报

CSTPCD北大核心
影响因子:0.328
ISSN:0254-6124
年,卷(期):2024.44(6)