PDN electro-thermal co-simulation and optimization of micro integrated navigation SIP chip
With the gradual miniaturization and integration of SIP chips,the chip has higher requirement for DC voltage drop,current density of PDN and the temperature rise control of the system.In this paper,DC voltage drop and current density is improved by changing the area of the current-carrying conductor,and at the same time,studies are made on the chip temperature rise which is controlled by reasonably optimizing the aperture of ther-mal-via array,the number of vias and the thickness of the copper plating to reduce the thermal resistance.Simula-tion results show that increasing the area of the current-carrying conductor can effectively reduce DC voltage drop and current density,still with a large margin left,and that the reasonable layout of thermal-via array can effective-ly control the chip temperature rise,thus improving the function and reliability of the chip.
micro integrated navigationSIP chipDC voltage dropthermal distributionelectro-thermal co-simulation
国家科技期刊平台
NSTL
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