基于单片机技术的试卷装订机设计
The Design of Papers Binding Machine Based on the Application of MCU
摘要
本文通过对高校使用的试卷装订机进行分析,指出了现有装订机所存在的弊端。为了提高装订机的装订性能,本文将现有装订机使用过程中的动作进行了分解,结合单片机技术,设计出了一款新颖的装订机.实践证明,该装订机能大大提高试卷装订效率。
Abstract
The paper through the analysis of existing university of papers binding machines, pointed out the weskness of Papers binding machine around the world. In order to improve the efficiency of the Papers binding machine,we will decompose the action which in u
关键词
单片机:试卷装订机:设计Key words
MCU/Papers binding machine/Design引用本文复制引用
基金项目
出版年
2011