首页|Flexible nanoimprint lithography enables high-throughput manufacturing of bioinspired microstructures on warped substrates for efficient Ⅲ-nitride optoelectronic devices

Flexible nanoimprint lithography enables high-throughput manufacturing of bioinspired microstructures on warped substrates for efficient Ⅲ-nitride optoelectronic devices

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Ⅲ-nitride materials are of great importance in the development of modern optoelectronics,but they have been limited over years by low light utilization rate and high dislocation densities in heteroepitaxial films grown on foreign substrate with limited refractive index contrast and large lattice mismatches.Here,we demonstrate a paradigm of high-throughput manufacturing bioinspired microstructures on warped sub-strates by flexible nanoimprint lithography for promoting the light extraction capability.We design a flex-ible nanoimprinting mold of copolymer and a two-step etching process that enable high-efficiency fabrication of nanoimprinted compound-eye-like Al2O3 microstructure(NCAM)and nanoimprinted compound-eye-like SiO2 microstructure(NCSM)template,achieving a 6.4-fold increase in throughput and 25%savings in economic costs over stepper projection lithography.Compared to NCAM template,we find that the NCSM template can not only improve the light extraction capability,but also modulate the morphology of AlN nucleation layer and reduce the formation of misoriented GaN grains on the inclined sidewall of microstructures,which suppresses the dislocations generated during coalescence,resulting in 40%reduction in dislocation density.This study provides a low-cost,high-quality,and high-throughput solution for manufacturing microstructures on warped surfaces of Ⅲ-nitride optoelectronic devices.

Flexible nanoimprint lithographyBioinspiredMicro-and nano-manufacturingⅢ-nitride epitaxyOptoelectronic devices

Siyuan Cui、Ke Sun、Zhefu Liao、Qianxi Zhou、Leonard Jin、Conglong Jin、Jiahui Hu、Kuo-Sheng Wen、Sheng Liu、Shengjun Zhou

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Center for Photonics and Semiconductors,School of Power and Mechanical Engineering,Wuhan University,Wuhan 430072,China

Department of Mechanical and Mechatronics Engineering,University of Waterloo,Waterloo ON,N2L 3G1,Canada

Jiangxi SMTC Semiconductor Co.,Ltd.,Nanchang 330096,China

The Institute of Technological Sciences,Wuhan University,Wuhan 430072,China

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National Natural Science Foundation of ChinaNational Key R&D Program of ChinaNational Key R&D Program of ChinaKey Research and Development Program of Hubei ProvinceKnowledge Innovation Program of Wuhan-Basic ResearchNational Youth Talent Support ProgramFundamental Research Funds for the Central Universities

520753942022YFB36036032021YFB36002042023BAB137

2024

科学通报(英文版)
中国科学院

科学通报(英文版)

CSTPCD
ISSN:1001-6538
年,卷(期):2024.69(13)