科学与信息化2024,Issue(3) :123-126.

改进型晶圆预对准算法

Improved Wafer Prealignment Algorithm

王石磊 李朋 陈胜华
科学与信息化2024,Issue(3) :123-126.

改进型晶圆预对准算法

Improved Wafer Prealignment Algorithm

王石磊 1李朋 1陈胜华1
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作者信息

  • 1. 宁波润华全芯微电子设备有限公司 浙江 宁波 315400
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摘要

随着半导体生产工艺的升级,在晶圆处理过程中需要对晶圆圆心进行更加准确的定位.传统的晶圆预对准系统采用的回转半径法、质心法以及圆最小二乘法无法有效避免测量误差引入的异常采样点问题.因此,本文在圆最小二乘法基础上,提出一种增加权重的改进型晶圆预对准算法,即在剔除干扰点的同时增加权重函数,在确定晶圆圆心坐标的同时,尽可能减少异常采样点对拟合结果的影响.

Abstract

With the upgrading of semiconductor production technology,the center of the wafer needs to be more accurately located in the process of wafer processing.The radius of rotation method,center of mass method and circle least square method used in traditional wafer prealignment system cannot effectively avoid the problem of abnormal sampling points introduced by measurement errors.Therefore,based on the circle least square method,an improved wafer prealignment algorithm with increased weight is proposed in this paper,that is,the weighting function is added while the interference points are removed.When the coordinates of the wafer center is determined,the influence of abnormal sampling points on the fitting results should be reduced as much as possible.

关键词

半导体生产/晶圆预对准/圆最小二乘法/权重函数

Key words

semiconductor production/wafer prealignment/circle least square method/weighting function

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出版年

2024
科学与信息化

科学与信息化

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