首页|波峰焊直通率提升工艺研究

波峰焊直通率提升工艺研究

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波峰焊是指将熔化的软钎焊料,经电动泵或电磁泵喷流成设计要求的焊料波峰,还可通过向焊料池注入氮气形成,使预先装有元器件的印制板通过焊料波峰,实现元器件焊端或引脚与印制板焊盘之间机械与电气连接的软钎焊.直通率是衡量相关工序质量稳定性的关键指标,本文从常见波峰焊缺陷分析、相关优化措施的制定等方面,对提升波峰焊直通率的工艺工法展开介绍.
Research on Process to Increasing Wave-Soldering First Pass Yield
Wave soldering refers to the process of spouting the molten soldering material into the soldering wave as per the design requirement by motor pump or electromagnetic pump,or by injecting nitrogen into the soldering pool,so that the printed board pre-loaded with components can pass through the soldering wave to realize the soldering of mechanical and electrical connection between the solder end or pin of the component and the soldering pad of the printed board.The first pass yield is a key indicator to measure the quality stability of the related processes.This paper introduces the process and method to increase the first pass yield of wave soldering through the analysis on common wave soldering defects and the formulation of relevant optimization measures.

wave solderingIPC-610 criteriaPTH welding fillingtemperature curvesoldering pad designprocess parameter

黄磊

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上海铁路通信有限公司 上海 200000

波峰焊 IPC-610标准 PTH焊接填充 温度曲线 焊盘设计 工艺参数

2024

科学与信息化

科学与信息化

ISSN:
年,卷(期):2024.(19)